A Metal-Embedded Packaging Structure for Performance Enhancement in Quantum-Dot-Converted LEDs

A Metal-Embedded Packaging Structure for Performance Enhancement in Quantum-Dot-Converted LEDs

Blog Article

A Sn-ball was integrated with a colloidal quantum dot light-emitting diode hp pavilion 15-eg1053cl package to achieve effective heat and reliability management.The electric, optical intensity, and heat distributions of the package were evaluated under various radiant fluxes; data were collected at the 90th hour of aging.Under 1 W/cm2, the areal temperature decreased from 38.

5 °C (without Sn-ball) to 12n/1200 wella 32.3 °C (with Sn-ball), which helped extend the lifetime of the colloidal quantum dots in the package.Specifically, the introduction of the metal ball structure engendered a two- to three-fold increase in lifetime.

The study findings could contribute toward integrating quantum dots into photonic devices.